Product Series

Process Capability

FPC Process Capability

Splicing size Copper plating
Single-sided board 250mm*600mm through hole 0.1mm
Double-sided board 250mm*400mm thickness 5um-20um
Line width and spacing Tool accuracy
single-sided board 50um/50um punching 0.03um
Double-sided board 50um/50um Interlayer misalignment 0.05mm
Surface treatment SMT
Electroplated nickel gold Ni:1-8um Au:0.025-1.25um push-pull force 1.0kgf
Nickel gold plating Ni:1-8um Au:0.025-0.1um Minimum component 0201
Tin plating T=5-35um Minimum solder pad 0.3mm
OSP T=0.15-0.5um Accuracy ±0.05mm

SMT Process Capability

Project Device Model Device Function Equipment processing capability
Minimum size (L*W) Maximum size (L*W) Plate thickness Component height Precision
Printing press Huancheng Xin CL-1200 Print solder paste evenly on the designated PAD positions on the PCB 80*55mm 1200*360mm 0.4-6mm NA Printing accuracy +/-0.03mm
Solder Paste Inspection (SPI) Machine SPI Mengtuo MTU531UL Printing solder paste status inspection, thickness, area, and volume inspection 50*50mm 1200*500mm 0.4-6mm <50mm Based on standard calibration blocks +/-1um
pick-and-place machine Chip mounter YAMAHA YSM10 Accurately attach the parts to the corresponding positions on the PCB board 50*50mm 460*1200mm 0.38-4. 2mm <6.5mm +/-0.025mm
Nitrogen reflow soldering N2 Reflow Jintuo JTR-1000D-NM Weld the parts well to the PCB 50*50mm 400*1200mm ≤25mm ≤25mm Lack of temperature control accuracy+/-1 degree
Optical Inspection Machine AOI hurley 3D AOI QL1200iX- LT Appearance inspection standards for product testing 50*50mm 600*1200mm 0.4-6mm <50mm Based on standard calibration blocks +/-1um
X-ray inspection machine X-RAY equipment Rilian LX2000F Detecting the bottom solder joints of the parts through X-ray fluoroscopy imaging 50*50mm 1200*550mm 0.4-6mm <50mm 5um(Light tube power 90k)
Plasma cleaning machine Plasma Penghe atmospheric plasma Product surface treatment 50*50mm 1500*500mm 0.1-3mm <3mm dyne value>38
Dispensing Machine Dispenser Mingsai FS700 Spraying UV glue to cover solder joints for insulation and protection 150*150mm 1200*500mm 25mm ≤25mm +/-0.015mm
UV Curing Synergistic transformation UV固化 Cure the adhesive by UV irradiation 50*50mm 1200*360mm 25mm <50mm Light intensity Max: 1500mw